Follow the latest ECMIESIA 2027 announcements, including abstract submission and registration deadlines, scientific program development, keynote speaker updates, venue information and participant notices.
Key dates and current participation information.
This page will be updated as the scientific program, speakers, venue and participant arrangements progress.
Researchers, academics, postgraduate students, engineers and industry professionals are invited to submit abstracts for oral or poster presentation across the ECMIESIA 2027 scientific themes. Abstract decisions are normally communicated within 7–10 days of submission.
Registration is open for presenting authors and non-presenting participants. Authors should normally complete registration after receiving their abstract acceptance. Participants attending without a presentation may register directly.
The program is being developed around advanced materials, nanoscience, functional and smart materials, energy materials, sustainable manufacturing, surface engineering, additive manufacturing, computational materials science, materials informatics, AI-enabled discovery and industrial applications.
The keynote programme brings together scientific leaders across materials science, nanoscience, energy systems, biomedical engineering, functional materials, robotics and advanced industrial technologies. Speaker information and programme roles will continue to be updated as the conference programme is finalised.
ECMIESIA 2027 will take place in Singapore from 27–29 January 2027. The exact hotel and conference venue are currently under confirmation and will be published on the Host Location page once finalised.
Scientific organisations, research institutions, technology companies, manufacturers, instrumentation providers, publishers and other relevant organisations may contact the conference team regarding sponsorship, exhibition and partnership opportunities.
Contact the ECMIESIA 2027 team for questions about abstracts, registration, programme development, speakers, venue information, visa letters, sponsorship or general participation.
